Services

LCCC provides SMEs and start-ups with access to advanced infrastructure and expert knowledge in the fields of microchips and semiconductor technologies.

Our services support companies at various stages of innovation — from idea evaluation and testing of technological solutions to validation and further development. By leveraging LCCC’s expertise and available resources, companies can more confidently develop innovative products, reduce technological development risks, and prepare their solutions for the next stages of growth.

Open Calls

LCCC regularly launches Open Call competitions, where SMEs and start-ups can apply for technological services in the field of microchips and related technologies.

These calls provide access to LCCC infrastructure, expert support, and technological capabilities necessary for the development, testing, and validation of new solutions. If you wish to use one of the available services or develop your technological idea, our team will help assess the possibilities and identify the most suitable collaboration format.

available services

The Latvian Chip Competence Centre (LCCC) is a national initiative that supports Latvia’s integration into the European semiconductor and integrated photonics ecosystem. The centre provides ecosystem stakeholders with opportunities to enhance knowledge, competencies, and skills to accelerate the growth of this sector.

Within the lifelong learning framework, courses and practical workshops will be offered to improve the skills of engineers, technicians, and managers.

Available Services

Coming soon

If you have questions about this service or any other of our services and upcoming open calls, contact our team.

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Pilot Lines

Pilot lines are European-level technology platforms that enable companies to develop, test, and validate new microchip technologies before their introduction to the market.

LCCC supports SMEs and start-ups in identifying the most suitable pilot lines across Europe and provides assistance in accessing this infrastructure for product and technology development.

APECS

Advanced packaging and heterogenous integration for electronic components and systems. APECS leads the way in advanced packaging and heterogeneous integration by providing diverse technologies on a single platform.
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FAMES

The FAMES Pilot Line pioneering initiative promotes semiconductor technologies in Europe by supporting the emergence of higher-performance, more energy-efficient, and more sustainable chip designs.
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Nano-IC

The NanoIC pilot line specifically targets the development of beyond-2nm systems-on-chip (SoC) by lowering low-barrier access to state-of-the-art equipment, and opportunities for advanced research and development of new materials, process steps, and modules.
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PIX Europe

The pilot line aims to accelerate the development of photonic chip technology—an essential component in the future of high-speed computing, communications, and quantum information systems, among others.
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WBG – Wide Band Gap

The pilot line focuses on Wide Bandgap semiconductors, particularly SiC and GaN, which are used in high-power and high-frequency applications.
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Results

Coming soon