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October 22, 2025

Latvia, Lithuania, and Estonia Signed a Memorandum of Understanding to Strengthen Cooperation

A new chapter for the Baltic semiconductor ecosystem!

On 22 October 2025, at the Techritory Forum in Riga, Latvia, Lithuania, and Estonia signed a Memorandum of Understanding to strengthen cooperation between their national Chip Competence Centres — marking a historic milestone for the Baltic region’s semiconductor ecosystem.
The agreement aims to accelerate innovation, expand research capacity, and enhance the Baltic region’s role in Europe’s semiconductor value chain.

Key areas of collaboration include:

  • Joint innovation and international visibility to position the Baltics as a rising semiconductor hub.
  • Shared research, training, and infrastructure to boost chip design, materials, and systems development.
  • Support for startups and SMEs through access to R&D facilities and pilot lines under Chips JU programs.

This historic partnership lays the foundation for a stronger, more connected, and competitive Baltic semiconductor ecosystem, contributing to Europe’s technological resilience and the goals of the European Chips Act.

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